Besi APAC Sdn Bhd

公司名称：Besi APAC Sdn Bhd
公司国家：马来西亚 Malaysia
公司地址：3 Jalan 26/7, Section 26, 40000 Shah Alam, Selangor Darul Ehsan, Malaysia
电话Phone No：60 3 5514 7777
邮箱email：[email protected]
联系人Contact：
网址：www.besi.com
公司简介：Develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, LED and solar energy. The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked die bonders and die sorting equipment.,Semiconductor Equipment & Supplies,SMT Equipment